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H5tq1g63efr-h9c

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H5tq1g63efr-h9c

H5TQ1G63DFR-TEC Electronic Distributor Hynix Semiconductor

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H5tq1g63efr-h9c

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WebH5TQ1G83DFR-H9C Hynix,H5TQ1G83DFR-H9C Datasheet.Rohs Code:Yes,Part Life Cycle Code:Obsolete,Ihs Manufacturer:SK HYNIX INC,Part Package Code:BGA,Package Description ... WebHynix, Rev. T H5TQ1G83TFR-H9C SG2567RD312893SE 256Mx72 (2GB. Text: SG5127RD325693UUD October 9, 2008 Ordering Information Part Numbers Description Device Vendor SG5127RD325693HAD 512Mx72 (4GB), DDR3, 240-pin Registered DIMM, Parity, ECC, 256Mx4 Based, PC3-10600, DDR3-1333-999, 30.00mm, Green Module …

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WebMar 29, 2015 · 芯片反向设计（抄芯片，克隆芯片，集成电路反向设计）的概念是对已有的集成电路芯片进行完全仿制设计，或在原有芯片的基础上进行部分改动设计然后依据现有工艺线的设计规则要求重新流片，可以通过对原有芯片进行压缩面积、更改更细线宽，从而达到降低芯片成本的要求。

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